Job Details

As a Senior Packaging Research and Development Engineer, you will solve the teams packaging challenges. In this role, you will be responsible for developing advanced packaging interconnect technologies for packaging cryogenic microwave devices. You will collaborate with researchers and engineers on the Quantum AI team, as well as academic and industrial partners externally, to develop the packaging and integration technologies used in our next generations of quantum computers. This role requires a person who can manage multiple projects simultaneously, spanning 3 D silicon, PCB, and MEMS packaging and interconnect technologies. In this role, you will leverage your advanced packaging and integration experience to advance our packaging technologies for higher signal density, improved signal integrity, and to provide a high quality quantum processor environment. You will bring curiosity and engineering intuition to develop the understanding needed to improve superconducting quantum hardw...Development Engineer, Packaging, Research, Development, Electrical Engineer, Computer Engineer, Technology